Die Attach Paste Adhesive & Underfill For Large and Small Dies

AIT offers some of the most advanced Die Attach paste adhesives engineered to improve long-term reliability, rapid inline curing, long pot-life, viscosity and thixotropic control for fast automated dispensing and manufacturing.

1. ME8412 is a rapid curing hyper-conductive die-attach paste

• Curing at 150°C within 15 minutes for wire-bonding up to 250°C
• Proven for both MIL-Std and commercial volume die-attach applications.
• Outstanding electrical and thermal conductivity with void-free and low BLT (bond-line thickness).
• Low moisture absorption and sensitivity for MSL Level 1 packaging.
• Built-in molecular flexibility for large area die-attach.
• ME8412-SLV is a stamp or pin-transfer low viscosity version.

2. ME7410-SSC is a snap-curing die-attach paste

• Snap-curing dielectric version for high volume commercial die-attaches.
• ME7415 is the rapid curing for thermally conductive dielectric die-attaches.

3. ME8630-SSC is a snap-curing conductive die-attach

• Proven curing in less than 5 minutes at 150°C and curable at 60°C.
• Proven for both MIL-Std and commercial volume die-attach applications
• Built-in molecular flexibility for large area die-attach.

Other proven representative products have a demonstrated record of more than 20 years of reliability for military and aerospace applications.

New adhesive underfill and stress relief material innovations for advanced stack chip packaging, flip chip packaging, through silicon vias (STV) filling and underfilling:

It takes special engineering for adhesives and underfill to flow into a thin layer of 25-100 micron gaps and through small silicon vias (STV) to provide stress relief even for large area dies.

1. UF-MC7880 is designed for flip chip underfill and filling through silicon vias operating environment

• Low viscosity at relatively low temperatures of 40-80°CRapid curing in seconds at 150°C-200°C
• Low coefficient of expansion (CTE) of  ~30 ppm/°C
• Long term stability at temperatures at 300°C
• Ideal for flip chip direct contact packaging and thermal compression or thermosonic fusion flip chip packaging

2. UF-MC7883 is designed to replace traditional moisture sensitive underfill materials:

• High flow at relatively low temperatures of 40-80°C
• Low coefficient of expansion (CTE) of ~19 ppm/°C
• Long term stability at temperatures at 300°C

Electrically Conductive Paste Adhesives Click on the Product for the TDS

Non-conductive Paste Adhesives

AIT offers many other Die Attach paste adhesives not shown on our web site. Please go to the Products Application Form to receive a recommendation from our office for your specific application.