SNAP-LID® Adhesive Preform Pre-application
Patent pending low cost pre-application of adhesive preforms on plastic, ceramic, metal lids. Instant tacking-bonding for in-line processes for both thermoplastic and epoxy-based adhesives. AIT provides both pre-applications on your parts or provides complete solution with lids.
COOL-LID® Lid Attach to Combine with Thermal Management
A solution incorporating heat-spreading interface from a flip chip device and module to the lid cover is accomplished with an AI Technology adhesive that is pre-applied and provides for a rapid bonding lid attach.This new technology combined the now world-renown COOL-PAD™ interface solution for devices generating more than 100 watts within a square inch area along with the snap-curing adhesive preform combine to provide a winning solution for the majority of lid attachment applications. COOL-LID® is a special cost effective patent-pending process where pre-application of thermal interface material and lid-seal adhesive are used. Lids may be constructed of copper, aluminum, and ceramics. If thermal performance is not critical, even plastic caps can be used. The B-staged lid seal adhesive and interface pad are dry to the touch and are ambient storable for 12 months. Both the adhesive and interface material will tack onto a substrate and form an intimate thermal contact at 150°C in a matter of seconds with nominal pressure of 10 psi. Full cure is achieved without pressure at 150°C in less than 5 minutes.
Lid Attach Dispensible Insulating and Conductive Adhesive
AIT engineered and designed several innovative lid-sealing solutions for optical, thermal, EMI and commercial component and module packaging with outstanding cost effectiveness. It is ideal for the MEMS and wafer level lid sealing applications. The following are some examples:
AI Technology produces one of the unique dispensible lid-seal adhesives that can be cured at relatively low temperature of 100-200°C and yet capable of withstanding operation temperature of beyond 300°C continuously. While not as perfect hermetic seals as metal and glass seal, the cured lid seals passed gross and fine leak tests for almost all commercial applications. It is ideal for CMOS and other optical imaging devices.
1. MC7883 Insulating Paste Adhesive:
- 100% solid, insulating lid-seal that cured inline at temperature of 175-200°C in a few seconds.
- Low coefficient of expansion (CTE) of less than 20 ppm/°C with low moisture absorption of less than 0.5% at saturation for long-term device reliability under thermal and environmental stresses.
- High glass transition of 240°C and long-term molecular stability above 300°C to ensure both standard commercial and military applications of 85C and 150°C continuously. It also enables the special ultra high temperature operational as sensors and electronic devices in oil wells and other specialty environments.
2. MC8880 paste adhesive:
- 100% solid, electrically conductive lid-seal that cured inline at temperature of 175-200°C in a few seconds.
- Low coefficient of expansion (CTE) of less than 25 ppm/°C with low moisture absorption of less than 0.5% at saturation for long-term device reliability under thermal and environmental stresses.
- High glass transition of 240°C and long-term molecular stability above 300°C to ensure both standard commercial and military applications of 85°C and 150°C continuously. It also enables the special ultra high temperature operational as sensors and electronic devices in oil wells and other specialty environments.
Solderable Ceramic, Glass and LCP Lids
Pre-Applied Adhesive Preforms
EMI Shielding Covers, Lids, and Caps without soldering
SNAP-LID® Adhesive Preform Pre-application
Patent pending low cost pre-application of adhesive preforms on plastic, ceramic, metal lids. Instant tacking-bonding for in-line processes for both thermoplastic and epoxy-based adhesives. AIT provides both pre-applications on your parts or provides complete solution with lids.
COOL-LID® Lid Attach to Combine with Thermal Management
A solution incorporating heat-spreading interface from a flip chip device and module to the lid cover is accomplished with an AI Technology adhesive that is pre-applied and provides for a rapid bonding lid attach.This new technology combined the now world-renown COOL-PAD™ interface solution for devices generating more than 100 watts within a square inch area along with the snap-curing adhesive preform combine to provide a winning solution for the majority of lid attachment applications. COOL-LID® is a special cost effective patent-pending process where pre-application of thermal interface material and lid-seal adhesive are used. Lids may be constructed of copper, aluminum, and ceramics. If thermal performance is not critical, even plastic caps can be used. The B-staged lid seal adhesive and interface pad are dry to the touch and are ambient storable for 12 months. Both the adhesive and interface material will tack onto a substrate and form an intimate thermal contact at 150°C in a matter of seconds with nominal pressure of 10 psi. Full cure is achieved without pressure at 150°C in less than 5 minutes.
LID-SEAL: Low Cost Sealing, Thermal & Shielding Solutions
Adhesive Preforms (Adhesive Film Pre-application for optical, component, and module lid sealing)
Patented pending low cost pre-application of adhesive on metal, ceramics, optical GLASS or LCP lids. Instant tacking-bonding for in-line processes for both thermoplastic and epoxy-based adhesives. AIT provides both pre-applications on your parts or provides complete solutions with optical lids. Passes fine and gross leaks and 85%RH/85C aging without fogging or change of bond strength.
| AIT Product | Applications | Resistivity (ohm-cm) | Thermal Conductivity (W/m-°C) | CTE ppm/°C | Die-Shear (psi) | Cure Schedule (temp/time) Flow Characteristics (pressure) |
|---|---|---|---|---|---|---|
| ESP7675-HF | Smaller ceramic lids Plastic lids of any size Passes gross and fine leaks Good moisture barrier | >1×1014 | 1.2 | 40 | >3,000 | Induce flow during placement at >100°C/14psi, Full curing @150°C/5min. without pressure Ambient storable for 12 mos. |
| ESP8680-HF | Metal lids for EMI Shielding Outstanding moisture barrier Low Stress with Low Temp Curing | <5×10-4 | >6.0 | 45 | >2,000 | Induce flow during placement at 80-100°C Full Curing 80-150°C with NO pressure Ambient storable for 12 mos. |
| TP7150 | Larger Lids and Devices Outstanding moisture barrier TP7150 for use <160°C | >1×1014 | 0.3 | >1,200 | Ambient storable for 12 mos. Instant melt-bonding at >10psi >200°C |
Solderless EMI Shielding with Pre-application Adhesives
Low cost pre-application of instant melt-bondable conductive adhesive preforms to replace soldering onto PWB. Instant insertion bonding with shielding effectiveness with pre-applied pressure-sensitive. Optional in-situ curing for additional strength upon heating.Instant tacking-bonding for in-line processes for both thermoplastic-based conductive lid shielding and sealing adhesives. AIT will pre-apply adhesive on your parts or provide a complete solution with metal lids and covers.
| AIT Product | Applications | Resistivity (ohm-cm) | Thermal Conductivity (W/m-°C) | CTE ppm/°C | Die-Shear (psi) | Cure Schedule (temp/time) Flow Characteristics (pressure) |
|---|---|---|---|---|---|---|
| CB8130 | EMI Shielding Outstanding moisture barrier Ease of reworking Highest performance | <5×10-4 | >6.0 | Flexible | >1,000 | Ambient storable for 12 mos. Instant melt-bonding at >150°C without pressure |
| CB8253-E | EMI Shielding Outstanding moisture barrier Ease of reworking Lowest cost solution | <5×10-3 | >6.0 | Flexible | >1,000 | Ambient storable for 12 mos. Pressure-sensitive with additional optional in-situ curing bonding at >150°C without pressure |
For more information and recommendation assistance, please contact AIT sales and engineering:
AIT sales and customer service: 1-609-799-9388 or Fax: 609-799-9308